Oxford Instruments plc (OXIG) to Issue Dividend of GBX 5.10 on January 10th

Oxford Instruments plc (LON:OXIG) declared a dividend on Tuesday, November 12th,Upcoming Dividends.Co.Uk reports. Investors of record on Thursday, November 28th will be paid a dividend of GBX 5.10 ($0.06) per share on Friday, January 10th. This represents a dividend yield of 0.24%. The ex-dividend date is Thursday, November 28th. The official announcement can be seen at this link.

Oxford Instruments Stock Performance

Shares of Oxford Instruments stock opened at GBX 2,079.50 ($26.12) on Tuesday. The company’s 50 day moving average price is GBX 2,080.53 and its two-hundred day moving average price is GBX 2,296.01. The company has a debt-to-equity ratio of 12.96, a current ratio of 1.64 and a quick ratio of 1.11. Oxford Instruments has a fifty-two week low of GBX 1,870 ($23.49) and a fifty-two week high of GBX 2,765 ($34.73). The firm has a market capitalization of £1.21 billion, a P/E ratio of 2,404.98, a P/E/G ratio of -3.56 and a beta of 0.96.

Analyst Ratings Changes

Several equities research analysts recently commented on the company. Shore Capital reaffirmed a “buy” rating on shares of Oxford Instruments in a research note on Wednesday, October 16th. Berenberg Bank decreased their target price on Oxford Instruments from GBX 2,925 ($36.74) to GBX 2,830 ($35.54) and set a “buy” rating for the company in a research report on Tuesday, November 12th.

Oxford Instruments Company Profile

Oxford Instruments plc provide scientific technology products and services for academic and commercial organizations worldwide. It operates through three segments: Materials & Characterisation, Research & Discovery, and Service & Healthcare. The company offers atomic force, electron, and Raman microscopy; deposition tools comprising plasma enhanced chemical vapour deposition, chemical vapour deposition, inductively coupled plasma chemical vapour deposition, atomic layer deposition, and ion beam deposition systems; and etch tools, including inductively coupled plasma etching, reactive ion etching, deep silicon etching, atomic layer etching, and ion beam etching systems.